发明名称 |
Circuit and method for heating an adhesive to package or rework a semiconductor die |
摘要 |
System for attaching a die to the die pad of a lead frame incorporating a resistive heating circuit into the die pad which heats up to cure an epoxy adhesive between the die and the pad and thereby attach the die to the pad. The heating circuit also heats up to loosen the adhesive so the die can be detached from the pad for rework.
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申请公布号 |
US2002175153(A1) |
申请公布日期 |
2002.11.28 |
申请号 |
US20020205826 |
申请日期 |
2002.07.25 |
申请人 |
HEMBREE DAVID R.;AKRAM SALMAN |
发明人 |
HEMBREE DAVID R.;AKRAM SALMAN |
分类号 |
H01L21/50;H01L21/58;H01L23/10;H01L23/495;H01L23/498;(IPC1-7):H05B3/00 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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