发明名称 Semiconductor light emitting device and manufacturing method thereof
摘要 On a semiconductor substrate (1), a double hetero structure portion (6) in which an active layer (4) having smaller band gap is sandwiched between semiconductor layers (3, 5) having larger band gap than that of the active layer (4) is formed. A light reflection film (9) is formed at least a part of side walls of the double hetero structure portion (6). As a result, a semiconductor light emitting device that light which leaks from side wall of light emitting area in a chip is reduced and emission light can be outputted efficiently can be obtained.
申请公布号 US2002176475(A1) 申请公布日期 2002.11.28
申请号 US20020152854 申请日期 2002.05.23
申请人 SAI HIRONOBU;ICHIHARA JUN 发明人 SAI HIRONOBU;ICHIHARA JUN
分类号 H01L33/02;H01S5/024;H01S5/042;H01S5/183;H01S5/22;H01S5/223;(IPC1-7):H01S3/08 主分类号 H01L33/02
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