| 摘要 |
A printed wiring board is provided which can be applied even to circuit boards operating at high speed, and which can suppress electromagnetic wave radiation, and which can suppress a deterioration in density of mounting. At the printed wiring board, a first signal wire layer, a first ground layer having a first power source wire, a second ground layer having a second power source wire, and a second signal wire layer, are laminated. The first ground layer and the second ground layer are interlayer-connected by many via holes. Return current, of signal current flowing through a signal wire, flows in the first ground layer, and a path of the return current is cut midway therealong at a position of the first power source wire. However, the return current is detoured by the via hole to the second ground layer, and flows thereat.
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