PACKAGED ELECTRONIC COMPONENT AND METHOD FOR PACKAGING AN ELECTRONIC COMPONENT

摘要

The invention relates to a packaged electronic component and to a method for packaging an electronic component, according to which a chip (1) is fastened to the top surface of a die pad (2). Said die pad (2) and the chip (1) are enclosed by a plastic material (3). A gel (11, 12) is disposed on the top surface of the chip (1) and on the bottom surface of the die pad (2).