发明名称 PRINTED CIRCUIT BOARD WITH MOUNTED COMPONENTS HOUSED IN A RESIN FOIL
摘要 <p>A system comprising a printed circuit board with circuits printed on it and electric and/or magnetic components that are electrically connected to these circuits, and further comprising a housing for the printed circuit board, said housing being formed of a synthetic resin foil that may surround the printed circuit board at least partly. The plastic foil is preferably folded around the printed circuit board so as to be box-shaped. Alternatively, the plastic foil may be a shrink foil.</p>
申请公布号 WO2002096169(A1) 申请公布日期 2002.11.28
申请号 IB2002001771 申请日期 2002.05.22
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