发明名称 LASER MACHINING APPARATUS
摘要 <p>A laser machining apparatus has a clamping electrode (17) provided near the laser machining position and a capacitance sensing electrode (18) around the clamping electrode (17). While applying a voltage between the clamping electrode (17) and a work (15), the capacitance (C) between the capacitance sensing electrode (18) and the work (15) is measured, and the focal point (12a) of a laser beam (12) is controlled in accordance with the measured capacitance (C).</p>
申请公布号 WO2002094498(P1) 申请公布日期 2002.11.28
申请号 JP2001004321 申请日期 2001.05.23
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