| 摘要 |
A microwave crosspoint switch array and a method of minimizing crosstalk and dispersion in such an array are provided. The array includes a substrate lower ground plane, a substrate dielectric, including a material having a first dielectric constant, at least two signal transmission lines which are deposited upon the substrate dielectric with a minimum spacing distance between the lines, and a coverplate, including a material having a second dielectric constant and a metallized upper ground plane. The material having the first dielectric constant is substantially similar to the material having the second dielectric constant. The signal transmission lines may be metallic. The second dielectric constant may differ from the first dielectric constant by less than 50%, or by less than 25%; for example, the material having the first dielectric constant may be gallium arsenide, and the material having the second dielectric constant may be alumina. The array may include an adhesive layer having a thickness and including a material having a third dielectric constant. The adhesive layer may be applied to the substrate dielectric and to the coverplate so as to structurally connect the substrate dielectric to the coverplate. The thickness of the adhesive layer may be substantially smaller than the minimum spacing of the signal transmission lines. For example, the minimum spacing of the signal transmission lines may be approximately equal to 150 mum, and the thickness of the adhesive layer may be less than 20 mum. The adhesive layer may be applied to the substrate dielectric and to the coverplate such that the adhesive layer is substantially free of air bubbles. The material having a third dielectric constant may be a thermoplastic material, such as polystyrene. The array may include as many as six or more signal transmission lines. The method may include a precision adhesion method of fusing the substrate to the coverplate.
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