发明名称 LASER PARRERING OF DEVICES
摘要 A method for forming an organic or partly organic switching device, comprising: depositing layers of conducting, semiconducting, insulating, or surface modifying layers by solution processing and direct printing; and defining high-resolution patterns of these layers by exposure to a focussed laser beam.
申请公布号 WO02095805(A2) 申请公布日期 2002.11.28
申请号 WO2002GB02405 申请日期 2002.05.22
申请人 PLASTIC LOGIC LIMITED;SIRRINGHAUS, HENNING;CAIN, PAUL, ALAN 发明人 SIRRINGHAUS, HENNING;CAIN, PAUL, ALAN
分类号 G03F7/004;B41M5/00;G03F7/00;G03F7/038;G03F7/039;G03F7/20;H01L21/027;H01L21/3205;H01L21/336;H01L21/768;H01L29/786;H01L51/00;H01L51/05;H01L51/30;H01L51/40 主分类号 G03F7/004
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