发明名称 |
WAFER MANUFACTURING METHOD, POLISHING APPARATUS, AND WAFER |
摘要 |
<p>The present invention provides a wafer manufacturing method and a wafer polishing apparatus which enable control of sags in a periphery of a wafer and improvement of nanotopology values thereof that is strongly required recently, and a wafer. In a polishing process for making a mirror surface of the wafer, a back surface of the wafer is polished to produce a reference plane thereof. <IMAGE></p> |
申请公布号 |
EP1261020(A1) |
申请公布日期 |
2002.11.27 |
申请号 |
EP20010976792 |
申请日期 |
2001.10.22 |
申请人 |
SHIN-ETSU HANDOTAI CO., LTD |
发明人 |
NETSU, SHIGEYOSHI;MASUMURA, HISASHI |
分类号 |
H01L21/302;H01L21/306;(IPC1-7):H01L21/304;B24B37/04 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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