发明名称 |
HEAT SINK MODULE AND AN ARRANGEMENT OF HEAT SINK MODULES |
摘要 |
A plate-like heat sink module with polygonal ground plan or shape has an upper side for securing a heat generating component and an underside comprises cooling ribs. The outside edges of the module have surface structure complementary with one another and with whose assistance a plurality of the identical heat sink modules can be joined in one plane, whereby the surface structures are fashioned so that a heat sink module can be joined to another heat sink module in only one orientation to form an arrangement of the heat sink modules. As a result of the arrangement of heat sink modules, a heat sink for the interconnection of a plurality of capacitors to form a capacitor bank can be produced in an especially flexible way. |
申请公布号 |
EP1260124(A2) |
申请公布日期 |
2002.11.27 |
申请号 |
EP20010913633 |
申请日期 |
2001.02.14 |
申请人 |
EPCOS AG |
发明人 |
HEBEL, RAINER;MICHEL, HARTMUT |
分类号 |
F28F3/02;F28F7/00;H01G2/08;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
F28F3/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|