发明名称 Underfloor heating and cooling for a raised access floor
摘要 Heating or cooling panels are supported by brackets fixed by screwing or clamping to the pillars of a raised floor such that the upper side of the heating or cooling panels are in contact with the underside of the floor panels. Each panel is formed from rigid polystyrene and has a groove in it's upper surface to locate a pipe carrying heating or cooling water. The surface of the groove and the top surface of the panel are covered with aluminium foil to improve the heat conduction between the pipe and the floor panel. The air in the void beneath the floor is also heated or cooled by the water pipes and this air may be admitted via vents to the room to provide additional heating or cooling. The panels may be narrower than the tiles of the access floor to permit continued access.
申请公布号 GB2375815(A) 申请公布日期 2002.11.27
申请号 GB20010004639 申请日期 2001.02.24
申请人 * THERMOBOARD LIMITED 发明人 REX ANTHONY * INGRAM
分类号 F24D3/16;(IPC1-7):F24D3/14;F24D3/12 主分类号 F24D3/16
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