METHOD OF PROCESSING WAFER

摘要

PROBLEM TO BE SOLVED: To improve a yield by ensuring the protection of the wafer surface to be protected in a method of processing the wafer. SOLUTION: In subjecting the one surface of the wafer 3 to prescribed processing, a peelable protective sheet 4 is deposited on one surface to be protected of the wafer 3 and the other surface of the wafer 3 is subjected to the prescribed processing.