| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition useful for electronic/electric materials, molding materials, coatings, adhesives, etc., which retains a transparency and a uniformity and shows an improved heat resistance and physical properties, and its cured product. SOLUTION: The epoxy resin composition essentially comprises an epoxy resin (A) having a boron content calculated in terns of B2 O3 , represented by the formula: [(C)+(D)] calculated in terns of B2 O3 }×100/ (A)+(B)+[(C)+(D)] calculated in terns of B2 O3 }, of 2 to 30 wt.%, an epoxy resin hardener (B), boron (C) and/or a borate (D). The cured product of an epoxy resin is obtained by curing the epoxy resin composition. Here, boron oxides of <=100 nm are uniformly and finely dispersed in the cured product.
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