| 摘要 |
FIELD: laser beam power and position control in micromechanics, microelectronics, photolithography, medicine, etc. SUBSTANCE: scanner has collimator, two identical chips, electric-to-ultrasonic wave conversion facility disposed inside chip on one of edges of each chip whose opposite edge carries ultrasonic oscillation absorber, and control unit. First chip is installed with its edge perpendicular to axis of laser beam whose polarization vector is perpendicular to chip axis [001]. According to first alternative of device chips are made of potassium dihydrophosphate or ammonium dihydrophosphate, or rubidium dihydrophosphate; according to second alternative they are made of tellurium dioxide. Electric-to- ultrasonic signal conversion facility in first alternative of device is made in the form of separate lithium niobate slices, 26-30 mcm thick and in second alternative, in the form of single lithium niobate slice, 11-13 mcm thick. EFFECT: enhanced scanning angle, reduced power of high- frequency control signal. 2 cl, 4 dwg
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