发明名称 METHOD FOR FORMING ALUMINUM FILM AND ALUMINUM FILM- FORMING COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a composition and a method for forming wirings and electrodes with ease and at a low cost which can suitably be used in a number of electronic devices. SOLUTION: The aluminum film-forming composition comprises a compound to be represented by formula (1): R<1> R<2> R<3> Al wherein R<1> , R<2> , and R<3> are the same or different and each a hydrogen atom, a 1-12C alkyl group, an alkenyl group, an alkynyl group, a phenyl group or an aralkyl group) and a solvent. The method for forming an aluminum film comprises using the composition, and an aluminum film, a wiring, and an electrode are formed of the composition.
申请公布号 JP2002338891(A) 申请公布日期 2002.11.27
申请号 JP20010146724 申请日期 2001.05.16
申请人 JSR CORP 发明人 YOKOYAMA YASUAKI;MATSUKI YASUO
分类号 B32B5/18;C09D185/00;H01L21/28;H01L21/283;H01L21/288;(IPC1-7):C09D185/00 主分类号 B32B5/18
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