| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing photosemiconductors which gives a cured product excellent in wet heat resistance and transparency. SOLUTION: The epoxy resin composition comprises 110-160 pts.wt. of a liquid acid anhydride curing agent (C) and 3-7 pts.wt. of a curing accelerator (D) based on 100 pts.wt. of a liquid epoxy compound represented by formula (I), or further comprises 0.1-20 pts.wt. of an initiator (E) which emits a cation species by heating based on 100 pts.wt. of the liquid epoxy resin, (wherein X is an oxygen atom, a sulfur atom, a bivalent group of -SO-, -SO2 -, -CH2 -, -C(CH3 )2 -, -CBr2 -, -C(Br3 )2 -, -C(CF3 )2 , -C(CCl3 )2 - or -CH(C65 )-, or a mere single bond connecting two cycloaliphatic groups, and R<1> -R<18> may be the same or different and are each a hydrogen atom, a halogen atom, an oxygen atom, a hydrocarbon group that may contain a halogen atom, or an alkoxy group that may contain a substituent group).
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