INSPECTION JIG OF SEMICONDUCTOR DEVICE AND ITS PRODUCTION METHOD

摘要

PROBLEM TO BE SOLVED: To provide an inspection jig and its production method capable of surely making contact of each measuring terminal to each electrode and producing at a low cost. SOLUTION: The inspection jig 10 is provided with a plurality of measurement terminals 20 for contacting a plurality of electrodes 4 of the semiconductor device on a substrate 16 for performing electric inspection of the semiconductor device. The measurement terminals 20 are formed with a heat curing conductive resin and is constituted capable of elastic deformation. The conductive resin is constituted mainly of an epoxy resin and silver powder. The measurement terminals 20 are formed with a printing method or a dispenser method.