发明名称 Plating system
摘要 A plating system able to gold plate only inner leads (102a) of a TAB frame (106), is provided with a mask (9) having an opening (9a) formed to correspond to the region to be plated and provided horizontally; an elevating means (II) for lowering the TAB frames (106) toward the mask (9); and a pressing means (III) for pressing the TAB frame (106) on to the mask (9); a plating solution being sprayed from nozzles (15) below the openings (9a) toward the openings (9a) to plate the plating region. <IMAGE>
申请公布号 EP1149936(A3) 申请公布日期 2002.11.27
申请号 EP20010303683 申请日期 2001.04.23
申请人 SHINKO ELECTRIC INDUSTRIES CO. LTD. 发明人 IWAMOTO, SHIGEKI
分类号 C25D5/02;C25D7/06;C25D7/12;C25D17/00;H01L21/60;H01L23/495;H05K3/18 主分类号 C25D5/02
代理机构 代理人
主权项
地址