| 摘要 |
PROBLEM TO BE SOLVED: To positively peel a one end part of a film F from a substrate P. SOLUTION: The film peeling device is provided with an end part peeling means 100 acting on the substrate P with the film F adhered to insulating resin P2 and partially peeling the one end part of the film F from the insulating resin P2. The end part peeling means 100 is provided with a stopper wall 41d stopping the substrate P in an end part peeling position, upper and lower clamp members 11 and 12 clamping the substrate P at the position, an air ejecting means 40 ejecting air in a gap between the one end part of the film F of the substrate P and a surface of the substrate P and partially peeling the one end part of the film F from the insulating resin P2, and upper and lower holding members 31 and 32 positioned so as to face both faces in the one end part of the substrate P via gaps.
|
