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发明名称
Method of reducing plasma charge damage for plasma processes
摘要
申请公布号
EP1227172(A3)
申请公布日期
2002.11.27
申请号
EP20010124618
申请日期
2001.10.15
申请人
APPLIED MATERIALS, INC.
发明人
ISHIKAWA, TETSUYA;DEMOS, ALEXANDROS T.;CHO, SEON-MEE;GAO, FENG;NIAZI, KAVEH F.;ARUGA, MICHIO
分类号
C23C16/52;C23C16/455;H01L21/205;H01L21/302;H01L21/31;(IPC1-7):C23C16/455
主分类号
C23C16/52
代理机构
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