发明名称 Solder material for forming solder coated circuit board and circuit board
摘要 There is provided a solder work material for forming solder-coated circuit boards, which is capable of preventing the malfunctions of these circuits that may be generated by voltage noises due to the volumetrical expansion of the flux residue in a soldered laminated ceramic capacitor, etc. even under the environments where temperatures fluctuate widely (for example, -40 DEG C to +85 DEG C), or that may be generated by voltage noises due to the fluctuation of parasitic capacity between circuits due to the presence of a flux residue. There is also provided a circuit board having a residual film of flux left thereon after the deposition of the solder work material. This solder work material is formed of a solder paste composition or a resin flux-cored solder, both comprising a flux containing, as a resin component, resin - based resin and acrylic resin for preventing the generation of voltage noises in electronic devices.
申请公布号 EP1260303(A1) 申请公布日期 2002.11.27
申请号 EP20020253332 申请日期 2002.05.13
申请人 NEC CORPORATION;TAMURA KAKEN CORPORATION 发明人 NOMURA, M.;OGA, T.;GIDO, T.;ONO, T.;TAKAHASHI, Y.;SASAKI, R.
分类号 B23K35/363;B23K35/02;B23K35/14;B23K35/22;B23K35/36;H05K3/34 主分类号 B23K35/363
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