发明名称 |
Solder material for forming solder coated circuit board and circuit board |
摘要 |
There is provided a solder work material for forming solder-coated circuit boards, which is capable of preventing the malfunctions of these circuits that may be generated by voltage noises due to the volumetrical expansion of the flux residue in a soldered laminated ceramic capacitor, etc. even under the environments where temperatures fluctuate widely (for example, -40 DEG C to +85 DEG C), or that may be generated by voltage noises due to the fluctuation of parasitic capacity between circuits due to the presence of a flux residue. There is also provided a circuit board having a residual film of flux left thereon after the deposition of the solder work material. This solder work material is formed of a solder paste composition or a resin flux-cored solder, both comprising a flux containing, as a resin component, resin - based resin and acrylic resin for preventing the generation of voltage noises in electronic devices. |
申请公布号 |
EP1260303(A1) |
申请公布日期 |
2002.11.27 |
申请号 |
EP20020253332 |
申请日期 |
2002.05.13 |
申请人 |
NEC CORPORATION;TAMURA KAKEN CORPORATION |
发明人 |
NOMURA, M.;OGA, T.;GIDO, T.;ONO, T.;TAKAHASHI, Y.;SASAKI, R. |
分类号 |
B23K35/363;B23K35/02;B23K35/14;B23K35/22;B23K35/36;H05K3/34 |
主分类号 |
B23K35/363 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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