Semiconductor device manufacturing method

摘要

To form NPN and PNP transistors on the same base for example to obtain a complementary bipolar transistor (1) it has been necessary to make an epitaxial layer a thick film, and this has resulted in deterioration of the characteristics of the NPN transistor. Also, because a step of forming an alignment mark has been necessary this has increased the number of manufacturing steps needed to make a complementary bipolar transistor. This invention provides a semiconductor device manufacturing method which solves this problem as follows: After a first opening (13) Äalignment mark (16)Ü and a second opening (14) are formed in an insulating film (12) formed on a semiconductor base (11) and a doping mask (15) is then formed on the semiconductor base (11), a third opening (17) is formed thereon with the alignment mark (16) as a reference. After an impurity (18) is introduced into the semiconductor base (11) through the third opening (17), the doping mask (15) is removed and after that an impurity (19) is introduced into the semiconductor base (11) by solid-phase diffusion through the second opening (14) and a first embedded diffusion layer (20) is thereby formed and at the same time the impurity (18) is caused to diffuse and form a second embedded diffusion layer (21). Then, after an epitaxial layer is formed, an impurity diffusion layer is formed therein by ion injection (not shown).