WIRE BONDING METHOD FOR BGA PACKAGE SKIPPING REJECT UNIT

摘要

PURPOSE: A wire bonding method for a BGA package is provided to prevent the loss of the efficiency of a packaging facility by skipping reject units during wire bonding process. CONSTITUTION: Multiple semiconductor chips(20) are packaged in a type of array of a unit on a PCB(10). A wire bonding process is performed successively along the each row in the array. Before a wire bonding process begins, two pad patterns and two lead patterns have to be perceived by the camera of a packing facility. If the camera does not sense a pad pattern or a lead pattern in a unit, whether the unit is a reject one(18), on which a semiconductor chip is not die-bonded, a package one(16) is judged. If a reject mark(13) in the unit is perceived, then the bonding process is skipped, otherwise halted, inferred as a process error.