| 摘要 |
PROBLEM TO BE SOLVED: To prevent a sealing resin from covering an ion sensitive part to impair a sensor function, and to simplify the mounting work process for it. SOLUTION: A frame part 11 is bonded to the surface side of a sensor chip A. The frame part 11 is formed of metal or synthetic resin like a cylinder having an opening part 11a, the diameter of which is not smaller than the ion sensitive part 6, and bonded to the sensor chip A with the ion sensitive part 6 facing to the opening part 11a. Accordingly, when the region outside the ion sensitive part 6 is sealed with sealing resin 23, the sealing resin 23 can be inhibited from flowing into the ion sensitive part 6 by the frame part 11 without a special device for covering the ion sensitive part 6, the sealing resin 23 can be prevented from covering the ion sensitive part 6 to impair the sensor function, the mounting work process for it can be simplified, and lowering of yield can be prevented. |
