发明名称 ELECTRICALLY CONDUCTIVE RESIN COMPOSITION AND MOLDING MATERIAL OR MOLDED PART PREPARED FROM THE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an electrically conductive resin composition which may yield an excellent electric conductivity at a low specific weight, and a molding material and a molded part prepared from this. SOLUTION: The electrically conductive resin composition or the molding material comprises at least an electrically conductive discontinuous fiber as constituent [A], a polybutylene terephthalate resin and/or a liquid crystal polyester resin as constituent [B] and a polycarbonate resin as constituent [C]. Here, the composition comprises constituents [A] and [B] at weight ratios of 1 to 50 wt.% and 0.01 to 6 wt.%, respectively.
申请公布号 JP2002338794(A) 申请公布日期 2002.11.27
申请号 JP20010150754 申请日期 2001.05.21
申请人 TORAY IND INC 发明人 WADAHARA EISUKE;ISHIBASHI SOICHI;KOJIMA YUJI
分类号 C08J5/00;B29B9/12;B29K67/00;B29K69/00;B29K105/12;C08K7/06;C08K9/02;C08K9/04;C08L67/02;C08L69/00;H01B1/20;H01B1/24;(IPC1-7):C08L67/02 主分类号 C08J5/00
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