| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for supplying components of a chemical plating solution preventing the accumulation of the other components into the chemical plating solution, and by which frequency of the full initial and half initial make-up of an electrolytic bath can be reduced. SOLUTION: In the operation of chemical copper plating on supplying of copper sulfate performed when the concentration of copper ions in a plating solution becomes below a prescribed lower limit value, supplying of excess amount of water compared with the conventional supplying of amount is performed. Thus, the accumulation of various components into the plating solution by the operation is suppressed, and deterioration in the plating solution is prevented. In this way, the plating solution can be retained in a satisfactory condition over a long period without requiring the full initial and the half initial make-up of the electrolytic bath, and a plating film of high quality can continuously be formed.
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