| 摘要 |
An integrated circuit/optoelectronic packaging system (100) which comprises OE and IC components packaged to provide electrical input/output, thermal management, an optical window, and precise passive or mechanical alignment to external optical receivers or transmitters. A transparent insulating substrate having electrical circuitry in a thin silicon layer formed on its top side is positioned between the optical fiber and the optoelectronic device such that an optical path is described between the optoelectronic device and the optical fiber core through the transparent insulating substrate. Arrays of fibers may be coupled to arrays of optoelectronic devices through a single transparent substrate. The optoelectronic devices are mounted on the transparent insulating substrate in a precise positional relationship to guide holes in the substrate. The optical fibers are fixed in an optical fiber connector and are held in a precise positional relationship to guide holes in the connector. Alignment is accomplished with complementary guide pins that pass through guide holes in the fiber optic connector and in the transparent substrate. The method is used for packaging optoelectronic devices (e.g.,VCSELs, photodetectors) electrically connected to integrated circuitry into a small scale package which is compatible with high volume automated assembly, handling, burn-in and testing. Automated testing includes electrical performance, optoelectronic performance an optical coupling between small scale package and optical fibers or waveguides. |
