LOADING APPARATUS FOR BGA SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A loading apparatus for a BGA(Ball Grid Array) semiconductor package is provided to improve productivity by automatically supplying a singulation apparatus with checkup completed materials. CONSTITUTION: A loading apparatus(LS) for transferring material(100) is installed between a cleaning apparatus(CS) and a singulation apparatus. A belt(10) having a gripper and a cylinder is located at one side of the loading apparatus(LS). A guiding part(20) having the first and second guiding rails(21,22) is located at the front end portion of the belt(10). A lead screw(32) connected to the first motor(31) is installed at one side of the first guiding rail(21). A transfer gripper(30) is located at the lead screw(32). A checkup part(40) is installed at the center portion of the first guiding rail(21). A rotation transfer hole having a revolving cylinder(51) installed between the first and second guiding rails(21,22). A transfer belt(54) connected with the second motor is installed at the second guiding rail(22). A magazine holding part(70) having a pusher(60) and a magazine(M) is located at one side of the second guiding rail(22). A failure magazine holding part(80) is installed at the other side of the second guiding rail(22).