发明名称 HORIZONTAL VARIABLE WAFER LOADING DEVICE OF SEMICONDUCTOR PRODUCTION FACILITY
摘要 PURPOSE: A horizontal variable wafer loading device of semiconductor production facility is provided to prevent a wafer breaking that is caused by align fail or pitch fail. CONSTITUTION: A cylinder and a shaft of it are installed inside a housing(10) and a transporting plate is connected to the shaft. Multiple slide buffers are placed on a transporting plate by a definite interval, supported by multiple interval supporting link. Two slots(26,28) in the buffer is prepared to load two wafers. Grooves(30) are formed on each side of slot. Each emission unit(32) and detection unit(34) of photo sensor are placed on the each side of upper part of the housing. When a wafer is not safely set in a buffer, light signal from the emission unit is intercepted by a wafer so that alarm signal is generated.
申请公布号 KR20020087534(A) 申请公布日期 2002.11.23
申请号 KR20010026083 申请日期 2001.05.14
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, JONG DEOK;KIM, YEONG GEUN
分类号 H01L21/205;(IPC1-7):H01L21/205 主分类号 H01L21/205
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