| 摘要 |
PURPOSE: A method for manufacturing printed circuit board is provided to increase density of circuit pattern, while improving performance of printed circuit board by preventing noise and signal delay caused due to the existence of tie bar. CONSTITUTION: A method for manufacturing printed circuit board, comprises a first step of attaching substrates(20) with each other through a carrier(50), wherein each substrate has a first metal layer(40) and a second metal layer(40') arranged at both side surfaces of an insulating layer(30), and the carrier is formed between second metal layers of the substrate; a second step of forming circuit patterns which are electrically connected to second metal layers, to first metal layers of substrates which are attached with each other; and a third step of performing gold plating by supplying power to bonding pads of circuit patterns through second metal layers.
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