| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of prior art of effective utilization of resin and equalization of pressure in the die channel being not taken into account. SOLUTION: On a die comprising a plurality of pots for pressure supplying mold resin, passages for interconnecting the pots, and a plurality of cavities arranged in a series, a lead frame arranged with a plurality of tabs for mounting a semiconductor element in the longitudinal and lateral directions is mounted. Resin is supplied to the pots, which are then pressed by means of a plurality of plungers thus injecting the resin into the cavities of the die. Both the productivity of resin molded semiconductor and the quality of product can be enhanced significantly. |
