| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a microphone which is reduced in size and thickness and which is not affected by a noise due to a wiring capacitance and to provide a method for manufacturing the same. SOLUTION: The microphone comprises a printed circuit board which has a through opening and in which a conductor layer is printed on a surface, a first semiconductor layer having a converter which installs a diaphragm film at a position corresponding to the opening to convert the vibration of the film into an electric signal and a first bump for inputting/outputting at the converter, and a second semiconductor layer having an amplifier for amplifying the converted signal and a second bump for inputting/outputting at the amplifier. The board has an extended conductor part for extending the semiconductor layer into the opening. The first and second semiconductor layers are housed in the opening in a state in which the first semiconductor layer is laminated on the second semiconductor layer via an insulating film with the film disposed above, and the bumps of the first and second semiconductor layers are connected to the conductor parts.</p> |
