发明名称 SWELLING SOLVENT COMPOSITION FOR TEXTURING RESIN MATERIAL AND DESMEARING AND REMOVING RESIN MATERIAL
摘要 <p>PROBLEM TO BE SOLVED: To realize metal resin bonding of high integrity bonding by texturing a swelling solvent composition and resin substance, desmearing the resin substance from a base, and removing the substances. SOLUTION: The lactone swelling composition is used to condition resin material for etching to form a porous textured surface on the resinous material. The porous texture permits the deposition of a metal on the resinous material such that high integrity bonding is formed between the texture resin material and the deposited metal. Such a bond between the metal and the resin martial prevents delamination of the metal and resin bond. The lactone solvent swelling compositions also desmear resin material from substrates. The lactone solvent swell compositions may be employed to treat resinous material used in the manufacture of printed wiring boards. Metal may be deposited on the textured resinous material by electroless plating.</p>
申请公布号 JP2002335067(A) 申请公布日期 2002.11.22
申请号 JP20020044916 申请日期 2002.02.21
申请人 SHIPLEY CO LLC 发明人 HIRST DEBORAH V;POOLE MARK A;GREEN SUSAN;SINITSKAYA INNA;GRAVES JOHN E
分类号 H05K3/26;C08J7/02;C09K13/00;C23C18/20;C23C18/24;C23C18/30;H05K3/38;(IPC1-7):H05K3/26 主分类号 H05K3/26
代理机构 代理人
主权项
地址
您可能感兴趣的专利