| 摘要 |
PROBLEM TO BE SOLVED: To obtain a polyimide silicone resin composition substantially containing no solvent and, therefore, capable of eliminating a process of solvent removal and giving high adhesiveness to base materials of various shapes, using a (meth)acrylic compound which is a reactive compound with the polyimide silicone resin as a diluent. SOLUTION: The solventless polyimide silicone resin composition comprises a polyimide silicone resin having a repeating unit represented by formula (1) (wherein X is a 4-valent organic group, Y is a bivalent organic group, Z is a bivalent organic group having an organosiloxane structure, and (p) and (q) are each independently a positive number), a (meth)acrylic compound, and a polymerization initiator, and has fluidity at 25 deg.C and contains substantially no solvent.
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