发明名称 HIGH-PRESSURE TREATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a high pressure treating apparatus, capable of effectively improving the treating performance and shortening the treating time, by carrying out substrate treatment using a treating fluid in a low-pressure state, in addition to substrate treatment using the treating fluid in a high-pressure state. SOLUTION: After valves V1, V3 are opened and a valve V2 is closed, substrate cleaning by supercritical carbon dioxide in a high-pressure state is carried out in a substrate-cleaning tank 5. After the substrate cleaning by the supercritical carbon dioxide is carried out for a predetermined interval, the valves V1, V3 are closed and the valve V2 is opened. As a result, supercritical carbon dioxide in the high pressure state in the substrate cleaning tank 5 flows into a buffer tank 6, and the pressure in the tank 5 is lowered inaccording to the capacity of the tank 6. Thus, in the substrate-cleaning tank 5, substrate- cleaning is conducted by the expanded supercritical carbon dioxide in low- pressure state. This supercritical carbon dioxide in the low-pressure state is sent out to a decompressor 7, after being pressurized to a predetermined pressure by a compressor 9.
申请公布号 JP2002334860(A) 申请公布日期 2002.11.22
申请号 JP20010136512 申请日期 2001.05.07
申请人 DAINIPPON SCREEN MFG CO LTD;KOBE STEEL LTD 发明人 MIZOBATA IKUO;MURAOKA YUSUKE;SAITO KIMITSUGU;KITAKADO RYUJI;INOUE YOICHI;OSHIBA HISANORI;WATANABE KATSUMITSU;YAMAGATA MASAHIRO
分类号 G02F1/13;B08B3/08;G02F1/1333;H01L21/304;(IPC1-7):H01L21/304;G02F1/133 主分类号 G02F1/13
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