| 摘要 |
The optical semiconductor casing (23) comprises an optical semiconductor component (8) whose front face is equippped with an optical sensor, the encapsulation means which include a support (2) and a pane (5) demarcating a cavity (6) where the optical component is placed and electrically connected to a network (11) by wires (16), and an optical lens (17) mounted in a support ring (18) and placed in the cavity between the optical sensor and the pane. The support ring (18) is fastened on the front face of the optical component (8) at the exterior of the optical sensor. The lens support comprises a joining ring (18a) interposed between the front edge of the support ring (18) and the pane (5). The pane (5) is coated with an opaque layer so to form a diaphragm with opening (22) situated opposite the lens. The encapsulation means also comprise an electromagnetic screening network (24) made of electrically conducting material and insulated from the electrical connection network (11). The support (2) has a hollow ring part surrounded by a ring part with a front face (4) where a peripheral part of the pane (5) is fastened. The screening network comprises an integrated flat part (25) extending below the optical component, and integrated columns (26) leading to the front face (4) of the support. In the first embodiment, the lens support is separated from the pane by a spacing, and does not comprise the screening network present in the second embodiment. In the third embodiment, the pane is replaced by an opaque electically conducting plate with opening for a transparent window situated opposite the lens. In the fourth embodiment, the support is in the form of a flat plate, and the pane is replaced by a cover in the form of a pan with opening for a transparent window situated opposite the lens. |
