MANUFACTURING SYSTEM OF SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent displacement or detachment of the substrate due to popping, when it is detached from the substrate-holding table, after placing it on the substrate holding table and subjecting it to a specified treatment. SOLUTION: The semiconductor device manufacturing system is provided with a placing means 18 for placing the substrate 11 on the substrate holding table 12, a treatment means for subjecting the substrate 11 which is placed on the substrate holding table 12 by the placing means 18 to a specified treatment, a detaching means 18 for detaching the substrate 11 from the substrate- holding table 12, after the specified treatment and an anti-popping means 19 for preventing the substrate 11 from popping, by covering the edges of the surface of the substrate 11, when the substrate 11 is detached from the substrate holding table 12 by the detaching means 18.