| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer wiring board excellent in heat resistance and bonding reliability after moisture is absorbed. SOLUTION: The multilayer wiring board is provided wherein polyimede insulating materials comprising a conductive layer are laminated with an adhesive containing at least epoxy curing component in between. The multilayer wiring board is manufactured, wherein, as a pre-process for lamination, a process to treat at least the surface of an adhesive layer bonded to the polyimede insulating material or the surface of the polyimede insulating material bonded to the adhesive layer is included. At least a thermal process may be included after a process with a processing liquid containing at least imidazole compound. |
