发明名称 RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To develop s resin composition having an excellent mechanical strength and water resistance without requiring fine pulverization. SOLUTION: This resin composition comprises 5-70 wt.% of a medium fiberboard powder having 50μm to 50 mm average particle diameter, dispersed in a fiber form as a reinforcing filler, 30-95 wt.% of a thermoplastic resin and 1-20 wt.% of a compatibilizing agent.
申请公布号 JP2002332411(A) 申请公布日期 2002.11.22
申请号 JP20010138553 申请日期 2001.05.09
申请人 TOYAMA PREFECTURE;TATEYAMA ALUM IND CO LTD;TAKAGI SEIKO CORP 发明人 MIZUNO WATARU;SAEKI KAZUMITSU;MAEDA KENJI;SAKAI YASUHIRO
分类号 E04C2/24;C08L97/02;C08L101/00;(IPC1-7):C08L101/00 主分类号 E04C2/24
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