| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method for forming bumps, using a resin film as a mask in which bumps can be formed with high accuracy by satisfactorily removing the resin film. SOLUTION: The method for forming bumps comprises a step for forming a resin film 12 on the surface of a substrate 10 provided with an electrode part 11, a step for forming an opening 12a so that the electrode part 11 is exposed, a step for filling the opening 12a with a bump-forming material 13, containing a metal of such a composition which has a temperature region of solid/liquid coexisting between solidus temperature and liquidus temperature, a step for heating at a temperature between the solidus temperature and the liquids temperature, a step for cooling below the solidus temperature, and a step for heating higher than the liquidus temperature, after the removal of the resin film 12. |
