| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of dividing a work, such as a semiconductor wafer or the like, which is adhered on an adhesive tape mounted on a holding frame, wherein a plurality of chips that are obtained by dividing the work along prescribed cutting lines do not touch each other during transportation. SOLUTION: This method of dividing the work contains an adhesive-tape mounting step, in which a thermoshrinking adhesive tape 10 that shrinks by heating to a prescribed temperature or above is mounted on a holding frame 9, a work adhering step in which the work is adhered on the upper face of the heat-shrinkable adhesive tape 10, a dividing step in which the work adhered on the upper face of the heat-shrinkable adhesive tape 10 is divided into a plurality of chips 80 by cutting along prescribed cutting lines, and an adhesive- tape tensioning step, in which space is formed between the chips by tensioning the heat-shrinkable adhesive tape 10 by heating the region between the region where the plurality of separated chips 80 are adhered on the heat-shrinkable adhesive tape 10 and the holding frame 9.</p> |
