| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a solid-state imaging pickup element for improving hardness in a microlens. SOLUTION: After a plurality of light-sensing element arrays are formed at the upper section of a semiconductor substrate 10, and a plurality of microlenses 25a are formed at the upper section of the semiconductor substrate 10, where the light sensing element arrays are formed. Then, DUV is irradiated to the microlenses 25a for hardening the surface of the microlenses 25a, the phenomenon of damaging the microlenses 25a is reduced in the succeeding assembly processes, and at the same time, generation of dark sports due to silicon powder is prevented, when die is cut.
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