| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can suppress intake of air in an electrode part during flip-chip mounting and obtain high connection reliability. SOLUTION: This semiconductor device is formed by flip-chip connecting a semiconductor device provided with an external connection electrode 102 and a mounting substrate provided with a substrate wiring. The sectional shape of the external connection electrode 102 in a planar direction is formed blade- like, elliptical, pentagonal, spindle-like, rhombic, etc., and is formed so that its tip becomes gradually thin going toward the flow direction of an adhesive resin (outer circumferential direction of the semiconductor device 101) during flip-chip connection, thus suppressing the disturbance of flowing of the adhesive resin and preventing air foams from being sucked on the understream side of the adhesive resin of the external connection electrode 102, so as to improve the reliability of flip-chip connection. |
