| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for bonding two sheets of substrates with high accuracy as in a display panel. SOLUTION: An upper surface plate height and swing and tilt position are regulated, with respect to the distance between the surface plates in bonding using sensors 8 and 10 for detecting the distance between the surface plates and actuators 9 and 11 for swinging and tilting the surface plates. A lower surface plate moving section 1 is activated in this position, and the horizontal direction of an upper substrate 4 and lower substrate 5 is positioned by cameras 2 and 7 at this position, by which the operation for aligning the clearance between the substrates can be carried out with minimal clearance state. The marks of the upper and lower substrates can therefore be recognized with high accuracy, and since the clearance is small, the deviation by a mechanical error is the descending operation of the upper surface plate is mall and the bonding can be conducted with high accuracy.
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