| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of dividing a work, such as a semiconductor wafer or the like, which is adhered on an adhesive tape mounted on a holding frame, so that a plurality of chips that are obtained by dividing the work along prescribed cutting lines do not touch each other during transportation. SOLUTION: This method for dividing a work divides the work into a plurality of chips by cutting along prescribed cutting lines, where the work is adhered on the upper face of an adhesive tape, which is formed circular in shape and is mounted on a holding frame. By using a heat-shrinkable adhesive tape that shrinks by heating for the adhesive tape, the work which is adhered on the heat-shrinkable adhesive tape is divided into a plurality of chips; the region of the heat-shrinkable adhesive tape where the chips are adhered is heated, and is moved to an expanding position to expand the adhesive tape, while applying compressed air thereto; and then the region of the heat-shrinkable adhesive tape between the region where the chips are adhered and the holding frame is heated to subject the adhesive tape to tension.</p> |
