| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device, that can prevent the heat deterioration of a transportation belt which transports and object to be heat-treated carried out of a heat treating furnace without using special treated belts. SOLUTION: This semiconductor manufacturing device 1 is provided with a spinner coating mechanism 2, a first transfer belt 3, which transfers a semiconductor wafer 7 to a heating furnace 4, after the wafer 7 has been carried out of the mechanism 2, the heating furnace 4 which is used for heat-treating the wafer 7. This device 1 is also provided with a cooling mechanism 5 and a second transfer belt 6, which transfers the wafer 7, after the wafer 7 has been carried out of the furnace 4. The cooling mechanism 5 is arranged between the heating furnace 4 and the second transfer belt 6 and cools the wafer 7 carried out of the furnace 4, by supplying air to the wafer 7 before the wafer 7 is transferred onto the second transfer belt 6. |
