发明名称 SHAPE MEASURING APPARATUS AND METHOD
摘要 PROBLEM TO BE SOLVED: To facilitate measuring thickness variation in a thin plate member such as a wefer accurately and efficiently. SOLUTION: The beam diameter of light gathered with a lens 1 is focused to ca. 0.1 mm by passing it in a polarization beam splitter 2 and irradiating the thin plate member 4 twice with measuring light, and the distortion of light signal is reduced to 1/2 by placing a lens 5 on a different surface of the polarization beam splitter 2.
申请公布号 JP2002333311(A) 申请公布日期 2002.11.22
申请号 JP20010139752 申请日期 2001.05.10
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KUBO KEIJI;IMADA YUKIO;TAKEUCHI HIROYUKI;HANDA KOJI;YOSHIZUMI KEIICHI
分类号 G01B11/24;G01B9/02;G01B11/02;H01L21/66;(IPC1-7):G01B11/24 主分类号 G01B11/24
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