| 摘要 |
PROBLEM TO BE SOLVED: To provide a MEMS relay and manufacturing method of the same. SOLUTION: A first wafer comprises a driving electrode formed on the lower surface of the same, and an input signal electrode and output signal electrode located on the same surface adjacent to the driving electrode, and a via hole formed to the electrode penetrating the first wafer, and a metal pad formed on the via hole. A second wafer is composed of a body part and a jointing and holding part. The body part has a sealing part at its peripheral part, sealing the gap between the first wafer and a third wafer. The jointing and holding part, located at the position kept apart insides from the body part, integrally formed with a silicon board, a passivation layer formed on the silicon board, and a contact electrode facing a signal electrode formed on both sides of the passivation layer, is jointed to the inside of the body part by extending from both sides of driving main body into respective directions so as to hold the driving main body, located at the position apart downwards from the upper surface of the body part, inside the second wafer. A third wafer has a cavity in which, the driving main body can rotate.
|
