发明名称 SURFACE-TREATED COPPER POWDER FOR COPPER PASTE, METHOD FOR PRODUCING THE SURFACE-TREATED COPPER POWDER, COPPER PASTE USING THE SURFACE-TREATED COPPER POWDER AND PRINTED CIRCUIT BOARD USING THE COPPER PASTE
摘要 PROBLEM TO BE SOLVED: To provide surface treated copper powder by which the viscosity of paste can be reduced, when the copper powder is treated with fatty acids and processed into a copper paste, and the change in the viscosity of the paste with lapse of time can effectively be suppressed. SOLUTION: The surface treated copper powder for copper paste is provided with a surface treated layer treated by using fatty acid, and the surface treated layer is formed of the metallic salt of fatty acid. In the method for producing the surface treated copper powder, copper powder and a solution containing fatty acid are contacted, and fatty acid is adsorbed on the surface of the copper powder, and drying treatment is performed thereto, so that the copper powder provided with the surface treated layer is produced. In this method, cleaning is performed with an organic solvent at least for one time, and then, the drying is performed.
申请公布号 JP2002332502(A) 申请公布日期 2002.11.22
申请号 JP20010140292 申请日期 2001.05.10
申请人 MITSUI MINING & SMELTING CO LTD 发明人 SAKAGAMI TAKAHIKO;UWAZUMI YOSHIAKI
分类号 B22F1/02;B22F1/00;H01B1/22;H01B5/00;H05K3/12;(IPC1-7):B22F1/02 主分类号 B22F1/02
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