发明名称 METHOD OF MANUFACTURING ALKALINE SOLUTION, THE ALKALINE SOLUTION, PATTERN-FORMING METHOD, RESIST FILM PEELING METHOD, CHEMICAL AGENT APPLYING DEVICE, WAFER-TREATING METHOD AND CHEMICAL AGENT SUPPLYING METHOD
摘要 PURPOSE: To prevent defects during the development of a resist film and the dimensional differences in a sparse and dense pattern. CONSTITUTION: A developer, in which gaseous molecules having oxidizing or reducing property are dissolved, is supplied from a developer supply nozzle 111 to a substrate 100 to be treated, on which surface an exposed photosensitive resist film is formed to develop the photosensitive resist film. Consequently, in-plane distribution of affinity between the resist film and a product is prevented, and the differences in development speeds that occur locally during developing are reduced. Furthermore, the reaction products are diffused rapidly into the developer, and sparse and dense dimension differences caused by differences in alkali concentrations are reduced.
申请公布号 KR20020087366(A) 申请公布日期 2002.11.22
申请号 KR20020026389 申请日期 2002.05.14
申请人 发明人
分类号 B01J19/00;B05C5/02;B05C11/10;B05D1/26;B05D3/00;B05D3/10;B05D7/00;B05D7/24;C02F1/68;C09K3/00;G03F7/30;G03F7/32;G03F7/42;H01L21/027;H01L21/311;(IPC1-7):H01L21/027 主分类号 B01J19/00
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